2oz 4 Layer Multilayer Pcbs Printed Circuit Board Manufacturing
Multilayer PCB Board Technology
The miniaturisation of electronic devices requires the
implementation of more and more functionalities in less and less
space. At the same time, the density of components on a circuit
board is also increasing. Multilayer circuit boards with four or
more copper layers are therefore used in almost all areas of
electronics.
FASTPCBA can rewiring is possible on up to 30 layers, which are
generally connected with plated through holes. Thicknesses of up to
3.20 mm are possible in PCB production.
Multilayer PCB Manufacturing Process
The main challenge with multilayer PCBs is to ensure the optimal
handling of the very thin layers of material. Continuously
automated production processes ensure consistent quality even with
high-layer multilayers.
Accurately designed registration processes guarantee maximum
uniformity of all layers - even with the finest structures. The
layer stack-up can be individually designed for many electrical
requirements (EMC, impedance, etc.) using insulation thicknesses
starting at 50 μm for cores and prepregs.
The resin filling and insulation thicknesses for the layer
stack-ups are calculated by means of intelligent software. Cost and
quality optimisation can also be achieved.
Performance spectrum
Number of layers 4 to 30
PCB thickness 0.50 to 3.20mm
Materials FR4, hybrid of different FR4 possible
Glass transition temperature Base material 135°C; 150°C; 170/180°C
Aspect Ratio Plated through holes ≤ 1:10
The values specified represent the maximum performance spectrum and
may be restricted in certain combinations.
Surfaces
Chemical nickel/gold
Chemical tin
Electroplated nickel/gold
HAL or HAL lead-free
OSP
others on request
General technical specifications
* Solder resist masks
Photosensitive coating systems, thermal final curing
Colours: green, red, blue, glossy black, matt black, white, yellow
Non-photosensitive coating systems, purely thermosetting: white,
black
* Additional printing
Identification/assembly
Hole filler/through hole filler
Peelable solder mask
Heatsink
Carbon
* Edge plating
The end faces of the PCB contour can be plated in order to improve
the EMC protection of a PCB, make electrical contact with the
housing of the module or meet increased cleanliness requirements.
* Milled plated through holes
It is possible to produce application-specific components with
so-called milled plated through holes. Due to the possibility of
contact on the front side, the resulting PCBs can be soldered as
components to another board (interposer).
* Contour machining
Contour production: milling and scoring
